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Model SZ-150L
Before curing
Appearance silver
12000 ~ 20000 cp viscosity range
Silver content of 78-85%
Ion content of Cl-, Na +, respectively, ≤ 0.8ppm
Tg130 ℃
After curing
Thermal expansion coefficient α1 = 35.5μm / m? ℃
Thermal conductivity of 3.0 W / m · ℃
Volume resistivity of 3.0 (× 10-4Ω · cm)
Use
Curing temperature 150 ℃
Curing time 30 ~ 60min
Shear strength greater than 3000psi
Hardness 80
Impact strength is greater than 10Kg/5000psi
Instantaneous high temperature 260 ℃
Decomposition temperature of 380 ℃
Storage period of 0 ℃ 3 months, -15 ℃ 6 months
Fg1. colloid curve of curing time varies with temperature
With increasing temperature, the shorter the curing time can be chosen according to actual situation, recommended temperature 150 ℃, 30min curing;
Fg2. cured thrust curve of strength with temperature
Thrust strength bond strength is directly related to the strength of the chip, in order to prevent the phenomenon of off-chip, press the graphic curve ranges.
Note:
1. glue in the refrigerated cases, must be warmed to 25 degrees, 2 hours later before use; (-15 ℃ ~ 0 ℃ under refrigeration)
2. curable to full, or it will fall film phenomenon;
3. glue is not used, should be sealed refrigeration, it will lead to larger viscosity, re-use drawing and other phenomena may occur;
4. Do not mix different glue may appear the phenomenon of blocking dispensing syringes.
Packing
25g / sticks, 35g / sticks, 200g / box
Before curing
Appearance silver
12000 ~ 20000 cp viscosity range
Silver content of 78-85%
Ion content of Cl-, Na +, respectively, ≤ 0.8ppm
Tg130 ℃
After curing
Thermal expansion coefficient α1 = 35.5μm / m? ℃
Thermal conductivity of 3.0 W / m · ℃
Volume resistivity of 3.0 (× 10-4Ω · cm)
Use
Curing temperature 150 ℃
Curing time 30 ~ 60min
Shear strength greater than 3000psi
Hardness 80
Impact strength is greater than 10Kg/5000psi
Instantaneous high temperature 260 ℃
Decomposition temperature of 380 ℃
Storage period of 0 ℃ 3 months, -15 ℃ 6 months
Fg1. colloid curve of curing time varies with temperature
With increasing temperature, the shorter the curing time can be chosen according to actual situation, recommended temperature 150 ℃, 30min curing;
Fg2. cured thrust curve of strength with temperature
Thrust strength bond strength is directly related to the strength of the chip, in order to prevent the phenomenon of off-chip, press the graphic curve ranges.
Note:
1. glue in the refrigerated cases, must be warmed to 25 degrees, 2 hours later before use; (-15 ℃ ~ 0 ℃ under refrigeration)
2. curable to full, or it will fall film phenomenon;
3. glue is not used, should be sealed refrigeration, it will lead to larger viscosity, re-use drawing and other phenomena may occur;
4. Do not mix different glue may appear the phenomenon of blocking dispensing syringes.
Packing
25g / sticks, 35g / sticks, 200g / box
