Thermal conductivity 2.5W/mk
Application industries: low-power semiconductor diodes, transistors
Purpose: LED chip bonding, 1,000 hours of low attenuation
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Conductive silver paste Ablestik 84-1LMISR4
Detail Features: viscosity 8000cp, 175 degrees 60 minutes 18 hours operating time.
Thermal conductivity 2.5W/mk Application industries: low-power semiconductor diodes, transistors Purpose: LED chip bonding, 1,000 hours of low attenuation Total0piece Related Comments |