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ABLEBOND 84-1LMISR4 is a one-component, low viscosity of the conductive silver paste. Plastic rheological properties, and for high-speed die attach packaging, no drawing, and tail; high purity,
Widely used in the semiconductor industry, the paste is mainly used for semiconductor chips for high-speed automatic dispensing machine, is the world's fastest growing out of a plastic conductive silver paste.
Component - epoxy containing silver
Appearance - Silver
Density 3.5g/cm3
Viscosity 25 ℃ 80Pa.s
Working life 25 ℃ 18hrs
Full curing time 175 ℃ * 60min
19kg peel test chip
CTE 40ppm / ℃
Thermal conductivity 2.5W/m.k
Volume resistivity 25 ℃ 0.0001Ohm-cm
Features: rheological properties, and for high-speed die attach packaging, no drawing, and tail; high purity, widely used in the semiconductor industry.
Shelf-10C * 6months
Conductive silver paste 84-1LMISR4
