What is LED packaging technology?

1. extended crystal, the dense arrangement of the chips a little easy to get open solid crystal. 2. solid crystal, the point at the bottom of the bracket conductive / non-conductive adhesive (conductive or not, as the chips are down or left and right type of PN junction PN junction type may be) and then into the bracket inside the chip. 3. a short bake, let the glue cure wire does not move when the chips. 4. wire, gold, silicon and support to turn. 5. before the test, the initial test can not be bright. 6. filling glue, glue the chip and stent wrapped up. 7. long baking, let the glue cure. 8. After the test, the test can be bright or not and whether the target electrical parameters. 9. Spectral color, the color and voltage points or less out of the same product. 10, packing.