High-power LED packaging technology
Date:2010-11-24 16:20
f photons generated in the loss of firing out, mainly in three aspects: the internal structure of the chip defect as well as the absorption; photons in the outgoing interface, the refractive index difference caused by the reflection losses; as a result of angle of incidence greater than the total reflection critical angle of total reflection caused by the loss. Therefore, a lot of chips out of the light can not reach all parts from the outside. Chip surface coated by a layer of relatively high r
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