High-power LED packaging technology
Date:2010-11-24 16:20
ite light LED package is research hotspot in the hot spots. LED package features include: 1. Mechanical protection to improve reliability; 2. To enhance heat dissipation, to reduce the chip junction temperature and improve the LED performance; 3. Optical control and improve the light efficiency and optimize the beam distribution; 4. Power Management including AC / DC shift and power control.
LED packaging methods, materials, structure and process of selection mainly by the chip architecture, op
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