High-power LED packaging technology
Date:2010-11-24 16:20
ll be in the CuW 1mm substrate, reducing the package thermal resistance, enhanced light-emitting power and efficiency; Lamina Ceramics companies developed LTCC metal substrate, Figure 2 (a), and the development of the corresponding LED packaging technology. First, the technology for eutectic solder was prepared high-power LED chips and the corresponding ceramic substrate, the LED chip and the substrate and then directly welded together. As the substrate integrated eutectic solder layer, electros
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