Bonding machine - gold wire bonders
large components, too, deal with it smoothly;Negative electron into a ball (EFO), into a ball the size of precisely adjustable, consistency, and this can be significant savings in gold and raise the chopper life;Easy to adjust various parameters (ultrasonic power, time, pressure, temperature, burning ball, arc, tail wire, aiming point height, span, etc.) are placed in the panel with a knob;PID temperature control system used, accurate and stable;HP120 gold wire bonding machine particularly suita
3/6 Next Pre Home page Last page
Back
Refresh
WAP Home
Web version
Login
11/13 18:41