TS-D6441BF automatic high-precision high-speed jet dispenser
a gel, paste, epoxy resin, for up to 30000CPS viscosity glue is widely used in semiconductor packaging, 3D coating and microelectronics industry, underfill, and this device as the core, Design a variety of automation equipment, has for the sound of Young Electronics, NXP Semiconductors and other high-end business services.
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