New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic
? -2.892.86Curing conditions ° c/hr170 ° c/1hr150 ° c/0.5hr150 ° c/0.5hrNa +PPM 10 100K + 5 50Cl-10 100Expansion coefficient α1? / M ℃ 807779α2205216175Tensile modulus of 25 ℃Mpa296529651523250 ℃ 9090122DSC (heat test) Onset (initial)℃ - 105Peak (peak) - 113Tg (TMA) point ℃ 375582Thermal conductivity (@ 121 ℃) W/mk0.61.21.83Volume resistivity Ohm-cm0.050.00420.0001173, epoxy resin SEL-1409/SEL-1409SE/SEL-1410/SEL-1500 etc.Features:1) low curing temperature (120 ℃ -130 ℃)2) Excellen
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11/15 04:56