Notice: Undefined index: group_show in /home/www/html/en.liang360.net/html/wap/sell.inc.php on line 16 New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic|Suppliers|en.liang360.net|Powered By Destoon
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New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic
t physical, mechanical, water and heat resistance3) According to requirements, the product fully applicable to the LED molding processTypical performance:Item SEL-EX-1409ASEL-EX-1409BAppearance transparent liquid transparent liquidMain material of epoxy resin anhydrideViscosity (25 ℃) 4000 ± 1000cps100 ± 20 cpsSpecific gravity 1.17 ± 0.021.17 ± 0.02After hardening characteristics:Item number value of the standardHardness 90Shore DPulled up the strength (kg /?) 1000JIS K-6911Soft and degree

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