Notice: Undefined index: group_show in /home/www/html/en.liang360.net/html/wap/sell.inc.php on line 16 New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic|Suppliers|en.liang360.net|Powered By Destoon
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New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic
(kg /?) 1200JIS K-6911Expansion coefficient (mm / mm / ℃) 8.0 × 10-5JIS K-6911Impact resistance coefficient (kg cm /?) 2.2JIS K-6911Tg point (℃) 135DSCWater Absorption (boiling water) 0.15JIS K-6911Electrical properties after hardening:Item number value of the standardBreakdown coefficients (kV / mm) 25Min.JIS K-6911Impedance (? Cm) 1016 Min.JIS K-6911Dielectric constant (25 ℃, 1kHz) 3.0JIS K-6911Dielectric tangent (25 ℃, 1kHz) 0.013JIS K-6911Optical properties after hardening:Item number v

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