New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic
alue of the standardTransmittance (%) 92% Min.500 ~ 700Nm, t = 1 mmRefractive index of 1.54Instructions:1) mixing ratioEpoxy resin: curing agent = 1: 1 (weight)2) The viscosity of the mixture700 ± 200 cps (25 ℃)3) Operating time *25 ℃ 5 小时40 ℃ 4 小时* Operating points for the year to 3,000 cps4) curing conditionsCondition 1 - Preheat 125 ℃, 1Hr + after baking 125 ℃, 3HrCondition 2 - Preheat 140 ℃, 30min. + After baking 125 ℃, 3Hr5) The time after mixing deaerationRoom temperature (25
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11/15 04:57