Special epoxy encapsulated LED (module potting)
help to increase the electrical properties of the device .Curing time: 25 ℃ * 5-6h (full cure to be 24h) or 80 ℃ * 1.5hNote: the ratio of the resin weight ratio should be, not to volume ratio to ratio, electronic weigh weight!Technical parametersProduct Name 102Item A component B component Appearance Black viscous liquid Brown liquid Viscosity mPa · s degree 15000-35000 50-100 Specific gravity 1.75 1.10 Mixed Viscosity mPa · s 1000 Mixing ratio pbw A: B = 4: 1 Glass transition tem
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11/15 05:21