Special epoxy encapsulated LED (module potting)
perature DSC ℃ 90 Hardness (shore D) 80 Water absorption rate% 0.1 Coefficient of linear expansion ppm / K 44 Thermal Conductivity W / mK 0.4 Temperature range -40 ~ 90 Dielectric Strength KV / mm (25 ℃) 20 Dissipation factor (1MHz) (25 ℃) 0.014 Dielectric constant (1MHz) (25 ℃) 3.53 Volume resistivity (DC500V) Ω · cm 1.2 × 1015 Packing: A Component: 4kg / barrel (plastic bucket); B components: 1kg / bucket (plastic barrel).Storage and transport1, A, B component to be protected
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11/15 05:33