Silver conductive adhesive
mperature of 380 ℃Storage period of 0 ℃ 3 months, -15 ℃ 6 monthsFg1. colloid curve of curing time varies with temperatureWith increasing temperature, the shorter the curing time can be chosen according to actual situation, recommended temperature 150 ℃, 30min curing;Fg2. cured thrust curve of strength with temperatureThrust strength bond strength is directly related to the strength of the chip, in order to prevent the phenomenon of off-chip, press the graphic curve ranges.Note:1. glue in the
2/3 Next Pre Home page Last page
Back
Refresh
WAP Home
Web version
Login
11/15 06:19