Conductive silver paste 84-1LMISR4
life 25 ℃ 18hrsFull curing time 175 ℃ * 60min19kg peel test chipCTE 40ppm / ℃Thermal conductivity 2.5W/m.kVolume resistivity 25 ℃ 0.0001Ohm-cmFeatures: rheological properties, and for high-speed die attach packaging, no drawing, and tail; high purity, widely used in the semiconductor industry.Shelf-10C * 6months
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11/15 06:51