Notice: Undefined index: group_show in /home/www/html/en.liang360.net/html/wap/sell.inc.php on line 16 New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic|Suppliers|en.liang360.net|Powered By Destoon
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New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic
ical, mechanical, water and heat resistance3) According to requirements, the product fully applicable to the LED molding processTypical performance:Item SEL-EX-1409ASEL-EX-1409BAppearance transparent liquid transparent liquidMain material of epoxy resin anhydrideViscosity (25 ℃) 4000 ± 1000cps100 ± 20 cpsSpecific gravity 1.17 ± 0.021.17 ± 0.02After hardening characteristics:Item number value of the standardHardness 90Shore DPulled up the strength (kg /?) 1000JIS K-6911Soft and degree (kg /?

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