LED special conductive silver paste
ition
Modified epoxy resin, silver
Solvent content (%)
/
4-5
/
Viscocitycps
30000
24,000
18000
Storage period (2-8 ℃)
6 months
6 months
3months
Specific gravity（25℃）
2.75
3.05
2.50
Cure Schedule
60~90min/150℃or90-120min/135℃
Features
Solvent-free bonding strength
Good operation process
Excellent solvent-free conductive
Die Shear strengthMPa
Si wafer / silver copper
14.6
8.9
11.2
Si wafer / glass or ceramic
17.3
10.3
12.8
Volume ResistivityΩ·cm
4.0×
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